Products & Services

VL-10-F

Additional information

1. Uniform Powder Treatment

The 1.65 L rotating drum ensures continuous mixing during plasma exposure, providing homogeneous surface modification of powders and granular materials.

2. Gentle and Controlled Plasma Processing

The 300W plasma power delivers stable and precise treatment, making it ideal for sensitive powders without causing thermal damage.

3. Accurate Gas Flow Control

Equipped with standard 2 MFCs (Ar and O₂), the system enables precise gas mixing and repeatable process parameters for consistent surface functionalization.

4. Compact and User-Friendly Operation

The bench-top design combined with a Siemens PLC control system ensures easy operation, reliable performance, and suitability for laboratory research and small-scale production.

Overview

The bench-top powder Vacuum Plasma Treatment System VL-10-F is specifically designed for uniform surface modification of powders and granular materials using a 1.65-liter rotating drum. The integrated drum rotation ensures continuous mixing during processing, enabling homogeneous plasma exposure and consistent treatment results. Powered by a stable 300W plasma generator, the system provides precise and gentle surface activation suitable for sensitive powder applications. Equipped with a Siemens PLC control system and standard 2 MFCs (Ar and O₂), it ensures accurate gas flow regulation, repeatable process control, and reliable laboratory-scale operation.

Specification

Technical Parameters
Plasma Main UnitDimension (L*W*H)620*550*680mm
Chamber (L*W*H) (customizable)200*250*200mm
Rotating Drum (L*Ø) (customizable)110*138mm
Weight w/o Pump200 kg
Plasma Power SupplyPlasma Power Supply13.56MHz
Power Rating300W
Control SystemControl Method (PLC)Siemens – SIMATIC HMI Smart 700 IE V5
Display7″ Touch Screen
Vacuum SystemChamber MaterialStainless Steel
Chamber Leak Rate> 15Pa/s
Ultimate Vacuum< 5Pa/s
Vacuum MeasurementPirani Vaccum Gauge
Venting Time≤ 15s
Pump Down Time20s~40s
Vacuum Pump24m³/h
Pump TypeOil-Sealed Pump or Dry Pump (opt.)
Gas SystemProcess Gas Flow Range0-300SCCM
Process Gas LinesStandard (Ar/O2) with 2 MFCs
Facility RequirementsEquipment Power SupplyAC220 ( ±10%)
Equipment Gas Source (Air Supply)≥ 0.4MPa
Equipment Power1.8kW
Operating Environment0°C – 50°C

Applications

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