| Main System Power Supply | 80x(1±10%)V(AC)50Hz~60Hz |
|---|---|
| Plasma Power Supply Frequency | 13.56MHz(600W)/□40KHz(1000W) |
| Power | ≤ 4kW |
| Working Vacuum | 10~100Pa |
| Compressed Air | ≥0.4MPa |
| Oxygen, AR, H, N, CF4 or other Process Gases | 0.3MPa~0.4MPa |
| Purified Cold Gas (n) | 0.3MPa~0.4MPa |
| Auxiliary Function | Standard with cavity temperature monitoring |
| Effective Treatment Area (WxD) mm | 390×335 |
| Number of Effective Processing Layers | 1-8 layers (Standard 3 layers, electrode plate layer spacing height 45mm) |
| Reaction Chamber (WxHxD) mm | 450x420x465 |
| Dimension (WxHxD) mm | 1050x1775x915 |
| Weight | 450 Kg |
Keylink Technology introduces the Plasma Treatment System for medium sized Panels in Printed Circuit Board Manufacturing and other related Applications.
Vacuum plasma is a suitable technology when your product or part requires treatment to all surfaces. Even 3D parts with hard to reach areas, are treated all over and are ensured an even and uniform treatment because of the vacuum that is build up in the treatment chamber.
Vacuum Plasma treatment is conducted in a controlled environment inside a sealed chamber, which is maintained at a medium vacuum, usually 0.1-1.0 mbar. The gas is energized by an electrical high-frequency field. The chamber is now filled with plasma, and all surfaces are ensured treatment.
Removing organic or inorganic matter, surface activtion, surface etching, wettability etc. getting a significant improvement using Vacuum Plasma technology.
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