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Keylink Technology appears at NEPCON ASIA 2023 Asian Electronic Production Equipment

From October 11 to 13, 2023, NEPCON ASIA 2023 Asian Electronic Manufacturing Exhibition was held as scheduled at the Shenzhen International Convention and Exhibition Center (Baoan New Hall). As the focusing surface adhesionl solution service and basic component testing of the electronics industry chain As an important domestic brand in the application field, Keylink Technology made a stunning appearance at this exhibition with its efficient plasma processing equipment, attracting many Chinese and foreign get interest to stop and communicate.

The special plasma surface treatment system PL-5050P-S with smart interface,  Power-real-time display, alarm query, frequency display, 485 communication, and can communicate with the host computer to collect data and power. Continuously adjustable and other advantageous features are suitable for surface cleaning and activation of circuit boards, IC chips, lithium batteries, mobile phone casings and other materials. This also provides relevant solutions for the continuously developing process applications in the electronics industry, with its high efficiency and accuracy. Helps improve product quality.

Case Study: Restoring Surface Cleanliness and Brightness of Copper Alloy with Keylink Atmospheric Plasma Systems

Copper alloys are widely used in electrical, electronic, automotive, and precision engineering applications where excellent conductivity, appearance, and surface quality

Case Study: Efficient Surface Contamination Removal and Adhesion Enhancement of PTFE Tubes using Keylink Vacuum Plasma Systems

Customer Challenge PTFE (Polytetrafluoroethylene) is widely used in medical devices, electronics, and precision industrial applications due to its exceptional chemical

Case Study: Efficient Removal of Surface Contamination on Nickel-Chromium Alloys using Keylink Atmospheric Plasma Technology

Surface contamination on nickel-chromium alloy materials is a common challenge in manufacturing processes that require reliable bonding, coating, printing, or

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