Plasma Treatment Technology for Improving UBM Wettability in Semiconductor Packaging
UBM plasma activation prepares the surface so solder can spread and bond better on semiconductor pads. It cleans and activates the surface at a very small scale, improving wetting, bonding strength, and solder ball reliability. In semiconductor packaging, even tiny contamination can cause weak joints or defects. Plasma treatment removes these contaminants and increases surface […]
