Plasma Surface Preparation for Semiconductor Encapsulation and Molding Processes
What Does Plasma Pre-Treatment Do Before Encapsulation? Plasma pre-treatment for encapsulation cleans surfaces, increases surface energy, and improves bonding before molding. It helps prevent delamination and supports stable semiconductor packaging. In semiconductor manufacturing, bonding failure often starts at the interface. Even thin contamination layers can weaken adhesion between the molding compound and the lead frame. […]
