{"id":7796,"date":"2026-03-19T09:00:00","date_gmt":"2026-03-19T09:00:00","guid":{"rendered":"https:\/\/www.keylinktech.com\/?p=7796"},"modified":"2026-04-09T06:53:01","modified_gmt":"2026-04-09T06:53:01","slug":"flip-chip-plasma-cleaning-underfill-reliability","status":"publish","type":"post","link":"https:\/\/www.keylinktech.com\/tr\/plasma-surface-technology\/application\/flip-chip-plasma-cleaning-underfill-reliability\/","title":{"rendered":"Plazma Y\u00fczey Haz\u0131rl\u0131\u011f\u0131 ve Alt Dolgu G\u00fcvenilirli\u011fi i\u00e7in Flip Chip Plazma Temizli\u011fi"},"content":{"rendered":"<p class=\"wp-block-paragraph\">Flip chip plazma temizli\u011fi, yap\u0131\u015ft\u0131rma i\u015fleminden \u00f6nce y\u00fczey kalitesini iyile\u015ftirir. Kirlili\u011fi giderir, y\u00fczey enerjisini art\u0131r\u0131r ve g\u00fc\u00e7l\u00fc bir yap\u0131\u015fmay\u0131 destekler. <a href=\"https:\/\/www.keylinktech.com\/tr\/plasma-surface-treatment-systems\/benefit\/adhesion-treatment\/\" target=\"_blank\" rel=\"noreferrer noopener\">alt dolgu yap\u0131\u015fmas\u0131<\/a>.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Bu makale, plazma i\u015fleminin nas\u0131l \u00e7al\u0131\u015ft\u0131\u011f\u0131n\u0131, yar\u0131 iletken paketlemede neden \u00f6nemli oldu\u011funu ve kusurlar\u0131 nas\u0131l \u00f6nledi\u011fini a\u00e7\u0131klamaktad\u0131r. Ayr\u0131ca temel i\u015flem parametrelerini ve ger\u00e7ek \u00fcretim deneyimlerine dair bilgiler de edineceksiniz.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\"><strong>Elektronikte Plazma Y\u00fczey Haz\u0131rlama Y\u00f6ntemini Anlamak<\/strong><\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">Plazma, y\u00fckl\u00fc par\u00e7ac\u0131klardan olu\u015fan iyonize bir gazd\u0131r. Malzemelerle mikroskobik d\u00fczeyde reaksiyona girer. Bu, kimyasallar kullan\u0131lmadan temizlik ve y\u00fczey aktivasyonu yap\u0131lmas\u0131n\u0131 sa\u011flar.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Elektronik \u00fcretiminde, plazma y\u00fczey i\u015fleme s\u00fcre\u00e7leri, yap\u0131\u015ft\u0131rma veya kaplama i\u015fleminden \u00f6nce malzemeleri haz\u0131rlar. Bu ad\u0131m, y\u00fczeyler aras\u0131nda g\u00fc\u00e7l\u00fc bir ba\u011flant\u0131 sa\u011flar.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><strong>Plazma Nedir?<\/strong><\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Plazma, temizleme ve aktivasyon i\u00e7in kullan\u0131lan enerjili bir gazd\u0131r.<\/li>\n\n\n\n<li>Ya\u011f ve oksit tabakalar\u0131 gibi kirlilikleri giderir.<\/li>\n\n\n\n<li>Y\u00fczey \u00f6zelliklerini de\u011fi\u015ftirerek yap\u0131\u015fmay\u0131 iyile\u015ftirir.<\/li>\n<\/ul>\n\n\n\n<h2 class=\"wp-block-heading\"><strong>Flip Chip Montaj\u0131nda Y\u00fczey Haz\u0131rl\u0131\u011f\u0131n\u0131n \u00d6nemi<\/strong><\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">Flip chip teknolojisi, lehim t\u00fcmsekleri kullanarak bir yongay\u0131 do\u011frudan bir alt tabakaya ba\u011flar. Bu tasar\u0131m, performans\u0131 art\u0131r\u0131r ve boyutu k\u00fc\u00e7\u00fclt\u00fcr.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Ancak bu i\u015flem y\u00fczey ko\u015fullar\u0131na kar\u015f\u0131 hassast\u0131r. K\u00fc\u00e7\u00fck bir kirlilik bile ar\u0131zaya neden olabilir.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Uygun haz\u0131rl\u0131k yap\u0131lmad\u0131\u011f\u0131nda sorunlar ortaya \u00e7\u0131kar. Dolgu malzemesinin yap\u0131\u015fmas\u0131 zay\u0131flar. Malzemenin i\u00e7inde bo\u015fluklar olu\u015fabilir. Is\u0131l i\u015flem s\u0131ras\u0131nda katman ayr\u0131lmas\u0131 meydana gelebilir. Dolgu malzemesi ayr\u0131ca d\u00fczensiz bir \u015fekilde akabilir.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Yap\u0131lan \u00e7al\u0131\u015fmalar, lehim kal\u0131nt\u0131s\u0131n\u0131n dolgu malzemesinin ak\u0131\u015f s\u00fcresini uzatt\u0131\u011f\u0131n\u0131 ve bo\u015fluklar olu\u015fturdu\u011funu g\u00f6stermektedir. Bu nedenle, montajdan \u00f6nce kirlili\u011fin giderilmesi kritik bir ad\u0131md\u0131r.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\"><strong>Plazma Temizleme Y\u00fczey Kalitesini Nas\u0131l \u0130yile\u015ftirir?<\/strong><\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">Flip chip plazma temizli\u011fi, malzemelerle etkile\u015fime giren enerjili gaz kullan\u0131r. Bu i\u015flem, istenmeyen katmanlar\u0131 ortadan kald\u0131r\u0131r ve yap\u0131\u015ft\u0131rma alan\u0131n\u0131 haz\u0131rlar.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Lehim kal\u0131nt\u0131lar\u0131n\u0131, organik kirlili\u011fi ve oksit tabakalar\u0131n\u0131 temizler. Bu tabakalar yap\u0131\u015fmay\u0131 engeller. Temizlendikten sonra, aray\u00fcz daha aktif hale gelir.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">\u0130\u015flem sonras\u0131nda y\u00fczey enerjisi artar. <a href=\"https:\/\/www.keylinktech.com\/tr\/blog\/contact-angle\/how-contact-angle-affects-adhesion-and-coating\/\" target=\"_blank\" rel=\"noreferrer noopener\">Temas a\u00e7\u0131s\u0131<\/a> azal\u0131r. S\u0131v\u0131lar daha h\u0131zl\u0131 ve daha e\u015fit \u015fekilde yay\u0131l\u0131r. Bu da yap\u0131\u015fma g\u00fcc\u00fcn\u00fc art\u0131r\u0131r.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Bu i\u015flem nano d\u00fczeyde temizlik sa\u011flar. Kuru, h\u0131zl\u0131d\u0131r ve kal\u0131nt\u0131 b\u0131rakmaz.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\"><strong>Plazma, Dolgu Malzemesinin Yap\u0131\u015fmas\u0131n\u0131 Nas\u0131l \u0130yile\u015ftirir?<\/strong><\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">Alt dolgu malzemesi, kal\u0131p ile alt tabaka aras\u0131ndaki bo\u015flu\u011fu doldurur. Lehim ba\u011flant\u0131lar\u0131n\u0131 korur ve gerilimi da\u011f\u0131t\u0131r.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">\u0130\u015flem sonras\u0131nda y\u00fczey enerjisi yakla\u015f\u0131k 30 mN\/m&#039;den 60 mN\/m&#039;nin \u00fczerine \u00e7\u0131kar. Temas a\u00e7\u0131s\u0131 ise yakla\u015f\u0131k 60\u00b0&#039;den 20\u00b0&#039;nin alt\u0131na d\u00fc\u015fer.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Bu, dolgu malzemesinin daha h\u0131zl\u0131 ve daha d\u00fczg\u00fcn akmas\u0131n\u0131 sa\u011flar. Daha iyi \u0131slatma, bo\u015fluk olu\u015fumunu azalt\u0131r. Ayr\u0131ca malzemeler aras\u0131ndaki yap\u0131\u015fma mukavemetini de art\u0131r\u0131r.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Bu i\u015flem, dolgu malzemesi uygulanmadan \u00f6nce kirlili\u011fin giderilmesini destekler. Termal d\u00f6ng\u00fc s\u0131ras\u0131nda olu\u015fabilecek ar\u0131zalar\u0131 \u00f6nlemeye yard\u0131mc\u0131 olur.<\/p>\n\n\n\n<figure class=\"wp-block-image size-full\"><img fetchpriority=\"high\" decoding=\"async\" width=\"428\" height=\"118\" src=\"https:\/\/www.keylinktech.com\/wp-content\/uploads\/2026\/04\/improved-underfill-flow-and-wetting-in-flip-chip-after-plasma-cleaning.png\" alt=\"\" class=\"wp-image-7798\" srcset=\"https:\/\/www.keylinktech.com\/wp-content\/uploads\/2026\/04\/improved-underfill-flow-and-wetting-in-flip-chip-after-plasma-cleaning.png 428w, https:\/\/www.keylinktech.com\/wp-content\/uploads\/2026\/04\/improved-underfill-flow-and-wetting-in-flip-chip-after-plasma-cleaning-300x83.png 300w, https:\/\/www.keylinktech.com\/wp-content\/uploads\/2026\/04\/improved-underfill-flow-and-wetting-in-flip-chip-after-plasma-cleaning-18x5.png 18w\" sizes=\"(max-width: 428px) 100vw, 428px\" \/><\/figure>\n\n\n\n<h2 class=\"wp-block-heading\"><strong>Proses Parametreleri ve M\u00fchendislik Hususlar\u0131<\/strong><\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">Plazma performans\u0131, kontrol edilen parametrelere ba\u011fl\u0131d\u0131r. Bu parametreler her uygulama i\u00e7in optimize edilmelidir.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Farkl\u0131 plazma t\u00fcrleri kullan\u0131lmaktad\u0131r. Bunlar aras\u0131nda RF plazma da yer almaktad\u0131r., <a href=\"https:\/\/www.keylinktech.com\/tr\/plasma-surface-technology\/type\/low-pressure-plasma-system\/\" target=\"_blank\" rel=\"noreferrer noopener\">d\u00fc\u015f\u00fck bas\u0131n\u00e7l\u0131 plazma<\/a>, Ve <a href=\"https:\/\/www.keylinktech.com\/tr\/plasma-surface-technology\/type\/what-is-atmospheric-plasma\/\" target=\"_blank\" rel=\"noreferrer noopener\">atmosferik plazma<\/a>. RF sistemleri tipik olarak 13,56 MHz frekans\u0131nda \u00e7al\u0131\u015f\u0131r.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">\u0130\u015flem s\u00fcresi \u00e7ok \u00f6nemlidir. \u00c7o\u011fu i\u015flemde maruz kalma s\u00fcresi 30 ila 120 saniye aras\u0131nda de\u011fi\u015fir. K\u0131sa s\u00fcre maruz kalma kal\u0131nt\u0131 b\u0131rakabilir. Uzun s\u00fcre maruz kalma ise hassas malzemeleri etkileyebilir.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Y\u00fczey enerjisi mN\/m cinsinden \u00f6l\u00e7\u00fcl\u00fcr. \u0130\u015flemden sonra bu de\u011fer artar ve \u0131slatma davran\u0131\u015f\u0131 iyile\u015fir.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Malzeme uyumlulu\u011fu dikkate al\u0131nmal\u0131d\u0131r. Farkl\u0131 malzemeler, termal genle\u015fme katsay\u0131s\u0131 (CTE) uyumsuzlu\u011fu nedeniyle farkl\u0131 \u015fekillerde genle\u015fir. Bu durum, termal d\u00f6ng\u00fc s\u0131ras\u0131nda gerilime neden olur.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Plazma, bu malzemeler aras\u0131ndaki ba\u011f\u0131n g\u00fc\u00e7lenmesine yard\u0131mc\u0131 olur. Aray\u00fcz sorunlar\u0131n\u0131 azalt\u0131r ve kararl\u0131l\u0131\u011f\u0131 art\u0131r\u0131r.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Bu s\u00fcre\u00e7ler yayg\u0131n olarak kullan\u0131lmaktad\u0131r. <a href=\"https:\/\/www.keylinktech.com\/tr\/plasma-surface-technology\/application\/semiconductor-cleaning-process-guide\/\" target=\"_blank\" rel=\"noreferrer noopener\">yar\u0131 iletken <\/a>ve otomotiv elektroni\u011fi end\u00fcstrilerinde. Sistemler genellikle a\u015fa\u011f\u0131daki ko\u015fullar alt\u0131nda kontrol edilir. <a href=\"https:\/\/www.keylinktech.com\/tr\/industry-trends\/plasma-treatment-machine-essential-certifications\/\" target=\"_blank\" rel=\"noreferrer noopener\">ISO 9001 standartlar\u0131<\/a>.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Plazma parametreleri dikkatlice kontrol edilmelidir. A\u015f\u0131r\u0131 maruz kalma polimer y\u00fczeyleri etkileyebilir.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\"><strong>Ger\u00e7ek \u00dcretim Vakalar\u0131nda Hata \u00d6nleme<\/strong><\/h2>\n\n\n\n<h3 class=\"wp-block-heading\"><strong>Vaka 1: Dolgu Bo\u015fluklar\u0131n\u0131n Azalt\u0131lmas\u0131<\/strong><\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">B\u00fcy\u00fck bir flip-chip paketinde, lehim kal\u0131nt\u0131s\u0131 nedeniyle bo\u015fluk olu\u015fumu g\u00f6zlemlendi. Plazma i\u015fleminden sonra, bo\u015fluk oran\u0131 25\u201340% azald\u0131. Ak\u0131\u015f daha homojen hale geldi.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><strong>Durum 2: Daha H\u0131zl\u0131 Alt Dolgu Ak\u0131\u015f\u0131<\/strong><\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Kirlili\u011fin giderilmesi, ak\u0131\u015f h\u0131z\u0131n\u0131 30%&#039;ye kadar art\u0131rd\u0131. Bu da \u00e7evrim s\u00fcresini k\u0131saltt\u0131 ve \u00fcretim verimlili\u011fini iyile\u015ftirdi.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><strong>Vaka 3: Katman Ayr\u0131lmas\u0131n\u0131n \u00d6nlenmesi<\/strong><\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Temiz ve aktif y\u00fczeyler yap\u0131\u015fmay\u0131 iyile\u015ftirdi. Bu, termal d\u00f6ng\u00fc s\u0131ras\u0131nda ar\u0131za riskini azaltt\u0131 ve \u00fcr\u00fcn \u00f6mr\u00fcn\u00fc uzatt\u0131.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\"><strong>Modern \u00dcretim Hatlar\u0131 i\u00e7in Y\u00fcksek Verimli Temizlik<\/strong><\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">Modern plazma i\u015fleme sistemleri, y\u00fcksek hacimli \u00fcretim s\u00fcre\u00e7lerini destekler. \u0130\u015flem s\u00fcresini k\u0131salt\u0131r ve s\u00fcre\u00e7 kontrol\u00fcn\u00fc iyile\u015ftirir.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Plazma sistemleri, y\u00fczey haz\u0131rl\u0131\u011f\u0131nda y\u00fcksek verimlilik sa\u011flar. Yap\u0131\u015ft\u0131rma i\u015fleminden \u00f6nce lehim art\u0131klar\u0131n\u0131 ve oksit tabakalar\u0131n\u0131 h\u0131zla ortadan kald\u0131r\u0131rlar.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Bu sistemler esnek \u00fcretime de destek vermektedir. Birden fazla makine paralel olarak \u00e7al\u0131\u015fabilir. Farkl\u0131 flip chip ta\u015f\u0131y\u0131c\u0131 boyutlar\u0131na uyum sa\u011flarlar.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Otomasyon, PLC kontrol\u00fc ve hareket platformlar\u0131 arac\u0131l\u0131\u011f\u0131yla desteklenir. Bu, manuel i\u015f g\u00fcc\u00fcn\u00fc azalt\u0131r ve i\u015flenen birimler aras\u0131ndaki varyasyonu d\u00fc\u015f\u00fcr\u00fcr.<\/p>\n\n\n\n<style>\n  .product-card {\n    display: flex;\n    align-items: center;\n    justify-content: center;\n    height: 400px;\n    border: 1px solid #ddd;\n    border-radius: 10px;\n    overflow: hidden;\n    box-shadow: 0 4px 10px rgb(0 0 0 \/ 0.1);\n    max-width: 900px;\n    margin: 0 auto;\n    gap: 40px;\n    padding: 20px;\n    box-sizing: border-box;\n  }\n\n  .product-left,\n  .product-right {\n    flex: 1 1 50%;\n    display: flex;\n    flex-direction: column;\n    justify-content: center;\n    align-items: center;\n    text-align: center;\n  }\n\n  .product-left {\n    gap: 20px;\n  }\n\n  .product-title {\n    font-size: 26px;\n    font-weight: 700;\n    color: #158462;\n    margin: 0;\n  }\n\n  .product-button {\n    background-color: transparent;\n    color: #158462;\n    border: 2px solid #158462;\n    padding: 12px 24px;\n    font-size: 15px;\n    border-radius: 6px;\n    cursor: pointer;\n    transition: transform 0.3s ease;\n    text-decoration: none;\n    display: inline-block;\n  }\n\n  .product-button:hover {\n    transform: scale(1.1);\n  }\n\n  .product-right img {\n    max-width: 100%;\n    max-height: 360px;\n    object-fit: contain;\n    border-radius: 10px;\n  }\n\n  @media (max-width: 768px) {\n    .product-card {\n      flex-direction: column;\n      height: auto;\n      padding: 15px;\n      gap: 15px;\n    }\n\n    .product-left,\n    .product-right {\n      flex: none;\n      width: 100%;\n      text-align: center;\n    }\n\n    .product-right img {\n      max-height: 300px;\n      margin-bottom: 15px;\n    }\n\n    .product-left {\n      order: 2;\n      gap: 10px;\n      align-items: center;\n    }\n\n    .product-right {\n      order: 1;\n    }\n  }\n<\/style>\n\n<div class=\"product-card\">\n  <div class=\"product-right\">\n    <img decoding=\"async\" src=\"https:\/\/www.keylinktech.com\/wp-content\/uploads\/2025\/02\/PL-B3150-On-Line-Plasma-Surface-Treatment-System-automatic.jpg\" alt=\"PL-B3150\" \/>\n  <\/div>\n  <div class=\"product-left\">\n    <span class=\"product-title\"><strong>PL-B3150 \u00c7evrimi\u00e7i Plazma Y\u00fczey \u0130\u015fleme Sistemi<\/strong><\/span>\n    <a href=\"https:\/\/www.keylinktech.com\/tr\/product\/pl-b3150-on-line-plasma-surface-treatment-system-automatic\/\" target=\"_blank\" class=\"product-button\">Daha Fazla Detay<\/a>\n  <\/div>\n<\/div>\n\n\n\n<h2 class=\"wp-block-heading\"><strong>Plazma Temizleme Y\u00f6ntemlerinin Geleneksel Temizleme Y\u00f6ntemleriyle Kar\u015f\u0131la\u015ft\u0131r\u0131lmas\u0131<\/strong><\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">A\u015fa\u011f\u0131daki tabloda elektronik \u00fcretiminde kullan\u0131lan yayg\u0131n temizleme y\u00f6ntemleri kar\u015f\u0131la\u015ft\u0131r\u0131lm\u0131\u015ft\u0131r.<\/p>\n\n\n\n<figure class=\"wp-block-table is-style-stripes\"><table class=\"has-fixed-layout\"><tbody><tr><td><strong>Y\u00f6ntem<\/strong><\/td><td><strong>Temizlik Kalitesi<\/strong><\/td><td><strong>Kal\u0131nt\u0131<\/strong><\/td><td><strong>H\u0131z<\/strong><\/td><td><strong>\u00c7evresel Etki<\/strong><\/td><\/tr><tr><td>Solventle Temizleme<\/td><td>Il\u0131man<\/td><td>Olas\u0131<\/td><td>Orta<\/td><td>Kimyasal at\u0131k<\/td><\/tr><tr><td>Mekanik Temizlik<\/td><td>S\u0131n\u0131rl\u0131<\/td><td>Hi\u00e7biri<\/td><td>Yava\u015f<\/td><td>Y\u00fczey hasar\u0131 riski<\/td><\/tr><tr><td>Plazma Tedavisi<\/td><td>Y\u00fcksek<\/td><td>Hi\u00e7biri<\/td><td>H\u0131zl\u0131<\/td><td>Kuru i\u015flem<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<p class=\"wp-block-paragraph\">Plazma ar\u0131tma sistemleri temiz ve kontroll\u00fc bir i\u015flem sa\u011flar. Kimyasal kullan\u0131m\u0131n\u0131 azalt\u0131r ve tutarl\u0131l\u0131\u011f\u0131 art\u0131r\u0131r.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\"><strong>Plazma Sistemlerini Flip Chip Uygulamalar\u0131 \u0130\u00e7in Uygun K\u0131lan Nedir?<\/strong><\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">Modern plazma sistemleri, flip chip montaj\u0131nda kullan\u0131lan karma\u015f\u0131k elektronik par\u00e7alar\u0131 i\u015fleyebilir. Metalleri, plastikleri ve seramikleri i\u015fleyebilirler.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Kal\u0131b\u0131n alt\u0131ndaki k\u00fc\u00e7\u00fck bo\u015fluklara ula\u015fabilirler. Bu, gizli alanlar\u0131n temizlenmesini ve aktive edilmesini sa\u011flar. \u0130\u015flem, t\u00fcm aray\u00fczlerde homojen kal\u0131r.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Bu sistemler otomatik \u00fcretim hatlar\u0131n\u0131 destekler. Bu da farkl\u0131 \u00fcr\u00fcn t\u00fcrleri i\u00e7in istikrarl\u0131 ve verimli i\u015fleme olana\u011f\u0131 sa\u011flar.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\"><strong>\u00c7\u00f6z\u00fcm<\/strong><\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">Plazma y\u00fczey haz\u0131rl\u0131\u011f\u0131, flip chip montaj\u0131nda kritik bir ad\u0131md\u0131r. Temizli\u011fi art\u0131r\u0131r, yap\u0131\u015fma mukavemetini y\u00fckseltir ve alt dolgu i\u015flemlerindeki kusurlar\u0131 azalt\u0131r. Verimi art\u0131rmay\u0131 ve ar\u0131za oranlar\u0131n\u0131 d\u00fc\u015f\u00fcrmeyi hedefleyen \u00fcreticiler i\u00e7in plazma i\u015fleme sistemleri pratik bir \u00e7\u00f6z\u00fcm sunmaktad\u0131r.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">\u00dcretim hatt\u0131n\u0131zdaki yap\u0131\u015ft\u0131rma performans\u0131n\u0131 art\u0131rmak ve kusurlar\u0131 azaltmak i\u00e7in KeyLink Technology&#039;nin plazma i\u015fleme sistemlerini ke\u015ffedin.<\/p>\n\n\n\n<div style=\"height:15px\" aria-hidden=\"true\" class=\"wp-block-spacer\"><\/div>\n\n\n\n<div class=\"wp-block-buttons is-content-justification-center is-layout-flex wp-container-core-buttons-is-layout-fe48e5de wp-block-buttons-is-layout-flex\">\n<div class=\"wp-block-button\"><a class=\"wp-block-button__link has-vivid-green-cyan-background-color has-background wp-element-button\" href=\"https:\/\/www.keylinktech.com\/tr\/contact\/\" target=\"_blank\" rel=\"noreferrer noopener\">\u00dccretsiz Teklif Al\u0131n<\/a><\/div>\n<\/div>\n\n\n\n<div style=\"height:15px\" aria-hidden=\"true\" class=\"wp-block-spacer\"><\/div>\n\n\n\n<h2 class=\"wp-block-heading\"><strong>S\u0131k\u00e7a Sorulan Sorular<\/strong><\/h2>\n\n\n\n<h3 class=\"wp-block-heading\"><strong>Plazma elektronik bile\u015fenlere zarar verir mi?<\/strong><\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Hay\u0131r. Kontroll\u00fc plazma i\u015flemleri, hassas bile\u015fenlere zarar vermeden y\u00fczeyleri temizlemek ve aktive etmek i\u00e7in tasarlanm\u0131\u015ft\u0131r.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><strong>Plazma elektronik bile\u015fenlere zarar verir mi?<\/strong><\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Hay\u0131r. Parametreler do\u011fru \u015fekilde ayarland\u0131\u011f\u0131nda, kontroll\u00fc i\u015flemler hassas bile\u015fenler i\u00e7in g\u00fcvenlidir.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><strong>Plazma, dolgu alt\u0131 ak\u0131\u015f\u0131n\u0131 nas\u0131l iyile\u015ftirir?<\/strong><\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Bu, y\u00fczey enerjisini art\u0131r\u0131r ve temas a\u00e7\u0131s\u0131n\u0131 d\u00fc\u015f\u00fcr\u00fcr. Bu sayede dolgu malzemesi e\u015fit \u015fekilde yay\u0131l\u0131r ve bo\u015fluklar\u0131 daha h\u0131zl\u0131 doldurur.<\/p>","protected":false},"excerpt":{"rendered":"<p>Flip chip plasma cleaning improves surface quality before bonding. It removes contamination, increases surface energy, and supports strong underfill adhesion. This article explains how plasma treatment works, why it is important in semiconductor packaging, and how it prevents defects. You will also learn key process parameters and real production insights. Understanding Plasma Surface Preparation in [&hellip;]<\/p>\n","protected":false},"author":3,"featured_media":7809,"comment_status":"closed","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[95],"tags":[],"class_list":["post-7796","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-application"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v28.2 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Flip Chip Plasma Cleaning: Underfill Adhesion | Keylink<\/title>\n<meta name=\"description\" content=\"Learn how flip chip plasma cleaning improves underfill adhesion, removes contamination, and prevents defects in semiconductor packaging.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" 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class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\\\/\\\/www.keylinktech.com\\\/plasma-surface-technology\\\/application\\\/flip-chip-plasma-cleaning-underfill-reliability\\\/#article\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.keylinktech.com\\\/plasma-surface-technology\\\/application\\\/flip-chip-plasma-cleaning-underfill-reliability\\\/\"},\"author\":{\"name\":\"keylink\",\"@id\":\"https:\\\/\\\/www.keylinktech.com\\\/es\\\/#\\\/schema\\\/person\\\/49a9d14effdf9a61c82c1dd0bbc61745\"},\"headline\":\"Plasma Surface Preparation and Flip Chip Plasma Cleaning for Underfill Reliability\",\"datePublished\":\"2026-03-19T09:00:00+00:00\",\"dateModified\":\"2026-04-09T06:53:01+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\\\/\\\/www.keylinktech.com\\\/plasma-surface-technology\\\/application\\\/flip-chip-plasma-cleaning-underfill-reliability\\\/\"},\"wordCount\":938,\"publisher\":{\"@id\":\"https:\\\/\\\/www.keylinktech.com\\\/es\\\/#organization\"},\"image\":{\"@id\":\"https:\\\/\\\/www.keylinktech.com\\\/plasma-surface-technology\\\/application\\\/flip-chip-plasma-cleaning-underfill-reliability\\\/#primaryimage\"},\"thumbnailUrl\":\"https:\\\/\\\/www.keylinktech.com\\\/wp-content\\\/uploads\\\/2026\\\/04\\\/Plasma-Surface-Preparation-for-Flip-Chip-Assembly-and-Underfill-Reliability.webp\",\"articleSection\":[\"Application\"],\"inLanguage\":\"tr\"},{\"@type\":\"WebPage\",\"@id\":\"https:\\\/\\\/www.keylinktech.com\\\/plasma-surface-technology\\\/application\\\/flip-chip-plasma-cleaning-underfill-reliability\\\/\",\"url\":\"https:\\\/\\\/www.keylinktech.com\\\/plasma-surface-technology\\\/application\\\/flip-chip-plasma-cleaning-underfill-reliability\\\/\",\"name\":\"Flip Chip Plasma Cleaning: Underfill Adhesion | Keylink\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.keylinktech.com\\\/es\\\/#website\"},\"primaryImageOfPage\":{\"@id\":\"https:\\\/\\\/www.keylinktech.com\\\/plasma-surface-technology\\\/application\\\/flip-chip-plasma-cleaning-underfill-reliability\\\/#primaryimage\"},\"image\":{\"@id\":\"https:\\\/\\\/www.keylinktech.com\\\/plasma-surface-technology\\\/application\\\/flip-chip-plasma-cleaning-underfill-reliability\\\/#primaryimage\"},\"thumbnailUrl\":\"https:\\\/\\\/www.keylinktech.com\\\/wp-content\\\/uploads\\\/2026\\\/04\\\/Plasma-Surface-Preparation-for-Flip-Chip-Assembly-and-Underfill-Reliability.webp\",\"datePublished\":\"2026-03-19T09:00:00+00:00\",\"dateModified\":\"2026-04-09T06:53:01+00:00\",\"description\":\"Learn how flip chip plasma cleaning improves underfill adhesion, removes contamination, and prevents defects in semiconductor packaging.\",\"breadcrumb\":{\"@id\":\"https:\\\/\\\/www.keylinktech.com\\\/plasma-surface-technology\\\/application\\\/flip-chip-plasma-cleaning-underfill-reliability\\\/#breadcrumb\"},\"inLanguage\":\"tr\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\\\/\\\/www.keylinktech.com\\\/plasma-surface-technology\\\/application\\\/flip-chip-plasma-cleaning-underfill-reliability\\\/\"]}]},{\"@type\":\"ImageObject\",\"inLanguage\":\"tr\",\"@id\":\"https:\\\/\\\/www.keylinktech.com\\\/plasma-surface-technology\\\/application\\\/flip-chip-plasma-cleaning-underfill-reliability\\\/#primaryimage\",\"url\":\"https:\\\/\\\/www.keylinktech.com\\\/wp-content\\\/uploads\\\/2026\\\/04\\\/Plasma-Surface-Preparation-for-Flip-Chip-Assembly-and-Underfill-Reliability.webp\",\"contentUrl\":\"https:\\\/\\\/www.keylinktech.com\\\/wp-content\\\/uploads\\\/2026\\\/04\\\/Plasma-Surface-Preparation-for-Flip-Chip-Assembly-and-Underfill-Reliability.webp\",\"width\":902,\"height\":478,\"caption\":\"Plasma Surface Preparation for Flip Chip Assembly and Underfill Reliability\"},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\\\/\\\/www.keylinktech.com\\\/plasma-surface-technology\\\/application\\\/flip-chip-plasma-cleaning-underfill-reliability\\\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Home\",\"item\":\"https:\\\/\\\/www.keylinktech.com\\\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"Plasma Surface Preparation and Flip Chip Plasma Cleaning for Underfill Reliability\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\\\/\\\/www.keylinktech.com\\\/es\\\/#website\",\"url\":\"https:\\\/\\\/www.keylinktech.com\\\/es\\\/\",\"name\":\"Plasma Surface Treatment Machine Manufacturer - KeyLink\",\"description\":\"my wordpress blog\",\"publisher\":{\"@id\":\"https:\\\/\\\/www.keylinktech.com\\\/es\\\/#organization\"},\"alternateName\":\"KeyLink\",\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\\\/\\\/www.keylinktech.com\\\/es\\\/?s={search_term_string}\"},\"query-input\":{\"@type\":\"PropertyValueSpecification\",\"valueRequired\":true,\"valueName\":\"search_term_string\"}}],\"inLanguage\":\"tr\"},{\"@type\":\"Organization\",\"@id\":\"https:\\\/\\\/www.keylinktech.com\\\/es\\\/#organization\",\"name\":\"KeyLink\",\"alternateName\":\"KeyLink\",\"url\":\"https:\\\/\\\/www.keylinktech.com\\\/es\\\/\",\"logo\":{\"@type\":\"ImageObject\",\"inLanguage\":\"tr\",\"@id\":\"https:\\\/\\\/www.keylinktech.com\\\/es\\\/#\\\/schema\\\/logo\\\/image\\\/\",\"url\":\"https:\\\/\\\/www.keylinktech.com\\\/wp-content\\\/uploads\\\/2024\\\/09\\\/keylink-logo.jpg\",\"contentUrl\":\"https:\\\/\\\/www.keylinktech.com\\\/wp-content\\\/uploads\\\/2024\\\/09\\\/keylink-logo.jpg\",\"width\":125,\"height\":52,\"caption\":\"KeyLink\"},\"image\":{\"@id\":\"https:\\\/\\\/www.keylinktech.com\\\/es\\\/#\\\/schema\\\/logo\\\/image\\\/\"},\"sameAs\":[\"https:\\\/\\\/www.facebook.com\\\/keylinktech\\\/\"]},{\"@type\":\"Person\",\"@id\":\"https:\\\/\\\/www.keylinktech.com\\\/es\\\/#\\\/schema\\\/person\\\/49a9d14effdf9a61c82c1dd0bbc61745\",\"name\":\"keylink\",\"image\":{\"@type\":\"ImageObject\",\"inLanguage\":\"tr\",\"@id\":\"https:\\\/\\\/secure.gravatar.com\\\/avatar\\\/8c2363f567f33045a49c8fde3ff3cb991b6cd896bec00faccb98b4cc63fb6185?s=96&d=mm&r=g\",\"url\":\"https:\\\/\\\/secure.gravatar.com\\\/avatar\\\/8c2363f567f33045a49c8fde3ff3cb991b6cd896bec00faccb98b4cc63fb6185?s=96&d=mm&r=g\",\"contentUrl\":\"https:\\\/\\\/secure.gravatar.com\\\/avatar\\\/8c2363f567f33045a49c8fde3ff3cb991b6cd896bec00faccb98b4cc63fb6185?s=96&d=mm&r=g\",\"caption\":\"keylink\"}}]}<\/script>\n<!-- \/ Yoast SEO plugin. -->","yoast_head_json":{"title":"Flip Chip Plazma Temizli\u011fi: Dolgu Malzemesinin Yap\u0131\u015fmas\u0131 | Keylink","description":"Flip chip plazma temizli\u011finin, alt dolgu yap\u0131\u015fmas\u0131n\u0131 nas\u0131l iyile\u015ftirdi\u011fini, kirlili\u011fi nas\u0131l giderdi\u011fini ve yar\u0131 iletken paketlemedeki kusurlar\u0131 nas\u0131l \u00f6nledi\u011fini \u00f6\u011frenin.","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/www.keylinktech.com\/tr\/plasma-surface-technology\/application\/flip-chip-plasma-cleaning-underfill-reliability\/","og_locale":"tr_TR","og_type":"article","og_title":"Flip Chip Plasma Cleaning: Underfill Adhesion | Keylink","og_description":"Learn how flip chip plasma cleaning improves underfill adhesion, removes contamination, and prevents defects in semiconductor packaging.","og_url":"https:\/\/www.keylinktech.com\/tr\/plasma-surface-technology\/application\/flip-chip-plasma-cleaning-underfill-reliability\/","og_site_name":"KeyLink","article_publisher":"https:\/\/www.facebook.com\/keylinktech\/","article_published_time":"2026-03-19T09:00:00+00:00","article_modified_time":"2026-04-09T06:53:01+00:00","og_image":[{"width":902,"height":478,"url":"https:\/\/www.keylinktech.com\/wp-content\/uploads\/2026\/04\/Plasma-Surface-Preparation-for-Flip-Chip-Assembly-and-Underfill-Reliability.webp","type":"image\/webp"}],"author":"keylink","twitter_card":"summary_large_image","twitter_misc":{"Yazan:":"keylink","Tahmini okuma s\u00fcresi":"5 dakika"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"Article","@id":"https:\/\/www.keylinktech.com\/plasma-surface-technology\/application\/flip-chip-plasma-cleaning-underfill-reliability\/#article","isPartOf":{"@id":"https:\/\/www.keylinktech.com\/plasma-surface-technology\/application\/flip-chip-plasma-cleaning-underfill-reliability\/"},"author":{"name":"keylink","@id":"https:\/\/www.keylinktech.com\/es\/#\/schema\/person\/49a9d14effdf9a61c82c1dd0bbc61745"},"headline":"Plasma Surface Preparation and Flip Chip Plasma Cleaning for Underfill Reliability","datePublished":"2026-03-19T09:00:00+00:00","dateModified":"2026-04-09T06:53:01+00:00","mainEntityOfPage":{"@id":"https:\/\/www.keylinktech.com\/plasma-surface-technology\/application\/flip-chip-plasma-cleaning-underfill-reliability\/"},"wordCount":938,"publisher":{"@id":"https:\/\/www.keylinktech.com\/es\/#organization"},"image":{"@id":"https:\/\/www.keylinktech.com\/plasma-surface-technology\/application\/flip-chip-plasma-cleaning-underfill-reliability\/#primaryimage"},"thumbnailUrl":"https:\/\/www.keylinktech.com\/wp-content\/uploads\/2026\/04\/Plasma-Surface-Preparation-for-Flip-Chip-Assembly-and-Underfill-Reliability.webp","articleSection":["Application"],"inLanguage":"tr"},{"@type":"WebPage","@id":"https:\/\/www.keylinktech.com\/plasma-surface-technology\/application\/flip-chip-plasma-cleaning-underfill-reliability\/","url":"https:\/\/www.keylinktech.com\/plasma-surface-technology\/application\/flip-chip-plasma-cleaning-underfill-reliability\/","name":"Flip Chip Plazma Temizli\u011fi: Dolgu Malzemesinin Yap\u0131\u015fmas\u0131 | Keylink","isPartOf":{"@id":"https:\/\/www.keylinktech.com\/es\/#website"},"primaryImageOfPage":{"@id":"https:\/\/www.keylinktech.com\/plasma-surface-technology\/application\/flip-chip-plasma-cleaning-underfill-reliability\/#primaryimage"},"image":{"@id":"https:\/\/www.keylinktech.com\/plasma-surface-technology\/application\/flip-chip-plasma-cleaning-underfill-reliability\/#primaryimage"},"thumbnailUrl":"https:\/\/www.keylinktech.com\/wp-content\/uploads\/2026\/04\/Plasma-Surface-Preparation-for-Flip-Chip-Assembly-and-Underfill-Reliability.webp","datePublished":"2026-03-19T09:00:00+00:00","dateModified":"2026-04-09T06:53:01+00:00","description":"Flip chip plazma temizli\u011finin, alt dolgu yap\u0131\u015fmas\u0131n\u0131 nas\u0131l iyile\u015ftirdi\u011fini, kirlili\u011fi nas\u0131l giderdi\u011fini ve yar\u0131 iletken paketlemedeki kusurlar\u0131 nas\u0131l \u00f6nledi\u011fini \u00f6\u011frenin.","breadcrumb":{"@id":"https:\/\/www.keylinktech.com\/plasma-surface-technology\/application\/flip-chip-plasma-cleaning-underfill-reliability\/#breadcrumb"},"inLanguage":"tr","potentialAction":[{"@type":"ReadAction","target":["https:\/\/www.keylinktech.com\/plasma-surface-technology\/application\/flip-chip-plasma-cleaning-underfill-reliability\/"]}]},{"@type":"ImageObject","inLanguage":"tr","@id":"https:\/\/www.keylinktech.com\/plasma-surface-technology\/application\/flip-chip-plasma-cleaning-underfill-reliability\/#primaryimage","url":"https:\/\/www.keylinktech.com\/wp-content\/uploads\/2026\/04\/Plasma-Surface-Preparation-for-Flip-Chip-Assembly-and-Underfill-Reliability.webp","contentUrl":"https:\/\/www.keylinktech.com\/wp-content\/uploads\/2026\/04\/Plasma-Surface-Preparation-for-Flip-Chip-Assembly-and-Underfill-Reliability.webp","width":902,"height":478,"caption":"Plasma Surface Preparation for Flip Chip Assembly and Underfill Reliability"},{"@type":"BreadcrumbList","@id":"https:\/\/www.keylinktech.com\/plasma-surface-technology\/application\/flip-chip-plasma-cleaning-underfill-reliability\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"Home","item":"https:\/\/www.keylinktech.com\/"},{"@type":"ListItem","position":2,"name":"Plasma Surface Preparation and Flip Chip Plasma Cleaning for Underfill Reliability"}]},{"@type":"WebSite","@id":"https:\/\/www.keylinktech.com\/es\/#website","url":"https:\/\/www.keylinktech.com\/es\/","name":"Plazma Y\u00fczey \u0130\u015flem Makinesi \u00dcreticisi - KeyLink","description":"benim wordpress blogum","publisher":{"@id":"https:\/\/www.keylinktech.com\/es\/#organization"},"alternateName":"KeyLink","potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/www.keylinktech.com\/es\/?s={search_term_string}"},"query-input":{"@type":"PropertyValueSpecification","valueRequired":true,"valueName":"search_term_string"}}],"inLanguage":"tr"},{"@type":"Organization","@id":"https:\/\/www.keylinktech.com\/es\/#organization","name":"Anahtar Ba\u011flant\u0131s\u0131","alternateName":"KeyLink","url":"https:\/\/www.keylinktech.com\/es\/","logo":{"@type":"ImageObject","inLanguage":"tr","@id":"https:\/\/www.keylinktech.com\/es\/#\/schema\/logo\/image\/","url":"https:\/\/www.keylinktech.com\/wp-content\/uploads\/2024\/09\/keylink-logo.jpg","contentUrl":"https:\/\/www.keylinktech.com\/wp-content\/uploads\/2024\/09\/keylink-logo.jpg","width":125,"height":52,"caption":"KeyLink"},"image":{"@id":"https:\/\/www.keylinktech.com\/es\/#\/schema\/logo\/image\/"},"sameAs":["https:\/\/www.facebook.com\/keylinktech\/"]},{"@type":"Person","@id":"https:\/\/www.keylinktech.com\/es\/#\/schema\/person\/49a9d14effdf9a61c82c1dd0bbc61745","name":"anahtar ba\u011flant\u0131","image":{"@type":"ImageObject","inLanguage":"tr","@id":"https:\/\/secure.gravatar.com\/avatar\/8c2363f567f33045a49c8fde3ff3cb991b6cd896bec00faccb98b4cc63fb6185?s=96&d=mm&r=g","url":"https:\/\/secure.gravatar.com\/avatar\/8c2363f567f33045a49c8fde3ff3cb991b6cd896bec00faccb98b4cc63fb6185?s=96&d=mm&r=g","contentUrl":"https:\/\/secure.gravatar.com\/avatar\/8c2363f567f33045a49c8fde3ff3cb991b6cd896bec00faccb98b4cc63fb6185?s=96&d=mm&r=g","caption":"keylink"}}]}},"_links":{"self":[{"href":"https:\/\/www.keylinktech.com\/tr\/wp-json\/wp\/v2\/posts\/7796","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.keylinktech.com\/tr\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.keylinktech.com\/tr\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.keylinktech.com\/tr\/wp-json\/wp\/v2\/users\/3"}],"replies":[{"embeddable":true,"href":"https:\/\/www.keylinktech.com\/tr\/wp-json\/wp\/v2\/comments?post=7796"}],"version-history":[{"count":1,"href":"https:\/\/www.keylinktech.com\/tr\/wp-json\/wp\/v2\/posts\/7796\/revisions"}],"predecessor-version":[{"id":7799,"href":"https:\/\/www.keylinktech.com\/tr\/wp-json\/wp\/v2\/posts\/7796\/revisions\/7799"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.keylinktech.com\/tr\/wp-json\/wp\/v2\/media\/7809"}],"wp:attachment":[{"href":"https:\/\/www.keylinktech.com\/tr\/wp-json\/wp\/v2\/media?parent=7796"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.keylinktech.com\/tr\/wp-json\/wp\/v2\/categories?post=7796"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.keylinktech.com\/tr\/wp-json\/wp\/v2\/tags?post=7796"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}